12 mat series high frequencies miniature quartz crystal units features ? wide frequency range coverage from 12mhz to 66mhz. applications ? radio communication equipment, pagers, cellular telephones, cordless telephones, clock source for micro-computers equivalent series resistance(e.s.r) dimensions conditions without notice (temperature: +25 c 2 c) standard specifications m e t i l o b m y s 9 0 3 - t a m s n o i t i d n o c y c n e u q e r f l a n i m o nf 0 z h m 8 2 o t z h m 2 1 l a t n e m a d n u f z h m 6 6 o t z h m 1 . 8 2 e n o t r e v o d r 3 e c n a r e l o t y c n e u q e r f d f / f 0 , m p p 5 1 m p p 0 3 y t i l i b a t s e r u t a r e p m e t y c n e u q e r f d f / f 0 , m p p 5 1 , m p p 0 3 m p p 0 50 1 - 0 7 + o t c c e c n a t i c a p a c d a o lc l f p 8 1 e c n a t s i s e r s e i r e s t n e l a v i u q er 1 . w o l e b e l b a t e h t e e s e s a e l p l e v e l e v i r dl d0 0 1 m . x a m w e c n a t i c a p a c t n u h sc 0 . x a m f p 0 . 5 g n i g a d f / f 0 . x a m m p p 55 2 + c 3 r a e y t s r i f , c e g n a r e r u t a r e p m e t g n i t a r e p oe p o t0 1 - 0 7 + o t c c e g n a r e r u t a r e p m e t e g a r o t so t s t5 4 - 0 8 + o t c c y t i l i b a r e d l o sl o s t0 8 2 0 5 1 e g a k c a p ( x a m . c e s 5 , . x a m c ) . x a m cy l n o s d a e l e p y t y c n e u q e r f . r . s . e 9 0 3 - t a m z h m 0 . 8 2 o t z h m 0 . 2 10 6 w . x a m z h m 0 . 6 6 o t z h m 1 . 8 20 0 1 w . x a m unit: mm mat-309 f 0.3 9.0 max. (1.1) f 3.1 10.0 min.
1 quartz crystal unit handling precautions 1. mounting precautions 1.1 lead type crystal units 1.1.1 structure tubular crystal units (vt, vtc, mgq, and mat) are hermetically sealed using glass (see figures 1 and 2). 1.1.2 unbending the lead (1) do not pull the lead excessively if unbending a lead or removing a crystal unit. the excessive force may crack the glass and reduce the degree of vacuum. this may eventually result in deterioration of the characteristics and may also break the crystal chip (see figure 3). 1.1.3 bending the lead (1) bend the lead so that the lead remains straight for more than 0.5mm from the case when soldering after bending a lead. if not, the glass may be cracked (see figures 5 and 6). (2) unbend the lead by pressing on the bent part from both the upper and lower sides with fixing the bottom of lead tightly.(see figure 4). 1.1.4 soldering heat the lead wire at a temperature of less than 280 c for 5 seconds or less, when mounting or removing a crystal unit. a long period time of heating may result in deterioration of the characteristics and may break the crystal unit. (2) always leave a length greater than the case diameter when bending a lead after soldering (see figure 7). make the length from the case to the printed circuit board (l) longer than the case diameter (d) so that the lead wire will not be pulled if the crystal unit falls over. soldering directly to the case will reduce the degree of vacuum and may result in deterioration of the characteristics and may break the crystal chip. breakage pull out figure 3 tweezers or needle-nose pliers case lead figure 4 solder printed circuit board 0.5mm figure 5 figure 6 0.5mm solder d l solder l>d figure 7 hermetic glass lead case figure 1 case lead figure 2 hermetic glass
2 1.2. smd type quartz crystal units 1.2.1 soldering (1) for mounting, it is recommended to solder at less than 230 c for 20 seconds or less. an example of the infrared ray reflow temperature profile is shown as follows (see figure 8). 2. cleaning (1) since low or intermediate frequency crystal units (vt ,vtc, and mgq) or oscillators use a small, thin crystal chip and the frequency approximates the frequency of an ultrasonic cleaner, the crystal chip may break easily. therefore, do not perform ultrasonic cleaning. (2) other crystal units may also break depending upon the ultrasonic cleaning condition. please check the ultrasonic cleaning condition. 3. mechanical shock (1) the quartz crystal units are designed to withstand a drop from a height of 75 cm onto a hard wooden board at least three times. however, the crystal chip may break if dropped, depending upon the how they are dropped. ensure that the crystal unit functions normally, if the crystal units have been dropped or subjected to an excessive mechanical shock. (2) unlike chip parts for resistors, and capacitors, the crystal unit has a crystal chip which is hermetically sealed inside. before using the crystal units, check the influence of shock caused during automatic mounting. example of smd product soldering conditions (reflow conditions) 250 200 150 100 50 0 30 60 90 120 figure 8 time(sec) temperature( c) 150 c 230 c c note:the temperature is the pcb surface temperature. 30~40sec 15~20sec +0 -10
4 the following is the standard packing. in the case of a small quantity of products (less than 1 lot), this packing may differ. 1. lead type products one hundred to five hundred units are packed in a vinyl bag. twenty to forty bags are packed in a box and shipped. the following products are individually packed in a partitioned styrofoam package (150 pcs.). several packages are bound and packed in a delivery container to ship. 2. smd products after being taped, the products are rolled onto a reel. the reels are packed in a box. tape and reel configuration emboss taping configuration reel configuration packing unit: mm e m a n t c u d o r p t o l r e p y t i t n a u q g a b r e p y t i t n a u q x o b r e p y t i t n a u q s e i r e s t v. s c p 0 0 0 , 0 1. s c p 0 0 5s g a b 0 2 s e i r e s c t v. s c p 0 0 0 , 0 1. s c p 0 0 5s g a b 0 2 s e i r e s t a m. s c p 0 0 0 , 4. s c p 0 0 1s g a b 0 4 e m a n t c u d o r p t o l r e p y t i t n a u q e g a k c a p r e p y t i t n a u q r e n i a t n o c r e p y t i t n a u q s e i r e s q g m. s c p 0 0 6. s c p 0 5 1s e g a k c a p 4 s e i r e s o x g m. s c p 0 0 1 . x o b a n i d e k c a p d n a t a m e v i t c u d n o c a o t n i k c u t s sp-t1/t2/t3 htf-vt-vtc note: specifications may differ when shipped in small quantities. w t (per eiaj rc-1009b) f 330 r1.0 20.5 f 210.8 f 130.5 120 20 20 f 50 max. 40(10p)0.2 4.00.1 2.00.05 f 1.5 + 0.1 0 1.750.1 w w 8.00.1 (per eiaj rc-1009b) 40(10p)0.2 4.00.1 2.00.05 f 1.5 + 0.1 0 1.750.1 w w 8.00.1 (per eiaj rc-1009b) e m a n t c u d o r p 1 t - p s 2 t - p s 3 t - p s c t v / t v - f t h l e e r r e p y t i t n a u q. s c p 0 0 0 , 2. s c p 0 0 0 , 3. s c p 0 0 0 , 3. s c p 0 0 0 , 3 2 t / 1 t - p sc t v / t v - f t h , 3 t / w 5 . 7 w0 . 6 1 2 t / 1 t - p sc t v / t v - f t h , 3 t / w4 . 6 1 t0 . 2
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